Effect of Underfill Filler Volume Fraction on Solder Fatigue and Residual Stress for Surface Mount Components Using Nonlinear Viscoelastic Finite Element Analysis.
Journal Article
·
· IEEE Transactions on Components and Packaging Technologies
OSTI ID:1107244
Abstract not provided.
- Research Organization:
- Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1107244
- Report Number(s):
- SAND2011-4469J; 465806
- Journal Information:
- IEEE Transactions on Components and Packaging Technologies, Journal Name: IEEE Transactions on Components and Packaging Technologies
- Country of Publication:
- United States
- Language:
- English
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