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Copper ionic liquids: Tunable ligand and anion chemistries to control electrochemistry and deposition morphology.

Journal Article · Mon Jul 01 00:00:00 EDT 2013 · Journal of Electroanalytical Chemistry

DOI:https://doi.org/10.1016/j.jelechem.2013.07.006· OSTI ID:1107019

Pratt, Harry; Ingersoll, David; Hudak, Nicholas; McKenzie, Bonnie B.

Abstract not provided.

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Research Organization:: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

DOE Contract Number:: AC04-94AL85000

OSTI ID:: 1107019

Report Number(s):: SAND2013-5594J; 465418

Journal Information:: Journal of Electroanalytical Chemistry, Journal Name: Journal of Electroanalytical Chemistry Vol. 704; ISSN 1572-6657

Country of Publication:: United States

Language:: English

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