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A Pin Pull Test A Pin Pull Test to Assess the Adhesion of Thin Film Conductors on LTCC Substrates.

Conference ·
OSTI ID:1106394
; ; ; ; ; ; ; ;
Abstract not provided.
Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1106394
Report Number(s):
SAND2013-5371C; 465295
Country of Publication:
United States
Language:
English

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