Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder.

Conference · Mon Jul 01 00:00:00 EDT 2013

DOI:https://doi.org/10.1115/IPACK2013-73074· OSTI ID:1106224

Neilsen, Michael K.; Vianco, Paul T

Abstract not provided.

• Research Organization: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 1106224
• Report Number(s): SAND2013-5400C; 465320
• Resource Relation: Conference: Proposed for presentation at the ASME InterPACK 2013 Conference held July 16-18, 2013 in Burlingame, CA.
• Country of Publication: United States
• Language: English