Steady-state cellular solidification of Al-Cu reinforced with alumina fibers
- Johnson Matthey Electronics, Spokane, WA (United States)
- Massachusetts Inst. of Tech., Cambridge, MA (United States). Dept. of Materials Science and Engineering
The steady-state directional solidification of aluminum-4.5 wt pct copper and aluminum-1.0 wt pct copper alloys reinforced with parallel, continuous, closely spaced alumina fibers is investigated under growth conditions that produce a plane front or cells in corresponding unreinforced alloys. Specimens were designed to have a central reinforced region surrounded by unreinforced metal of the composite matrix composition. Each was produced by pressure infiltration, subsequently remelted, directionally solidified, and quenched to reveal the liquid/solid metal interface. Both unreinforced and composite sections were characterized to determine solidification front morphology and degree of microsegregation. In the unreinforced portion of the3 samples, the transition from plane-front to cellular solidification was observed to correspond to a coefficient of diffusion of copper in liquid aluminum of 5 {times} 10{sup {minus}9} m{sup 2} {times} s{sup {minus}1}, in agreement with published values. Cell lengths, analyzed using a finite-difference model of microsegregation, are in agreement with the Bower-Brody-Flemings (BBF) model for cell tip undercooling. In the composite portion of the samples, the alloys solidify free of lateral microsegregation for all solidification conditions investigated, in agreement with theory. The shape of the liquid/solid metal interface near the fibers indicates a much lower fiber/liquid metal interfacial energy than fiber/solid metal interfacial energy. In the composite, plane front solidification is therefore not observed even when plane front solidification obtains in the unreinforced alloy. It is shown that geometrical constraint imposed on deep cells by the fibers causes significant increases in cell tip undercoolings, in agreement with current analyses of deep cell solidification.
- Sponsoring Organization:
- USDOE
- OSTI ID:
- 109792
- Journal Information:
- Metallurgical Transactions, A, Journal Name: Metallurgical Transactions, A Journal Issue: 8 Vol. 26; ISSN 0360-2133; ISSN MTTABN
- Country of Publication:
- United States
- Language:
- English
Similar Records
Kinetic undercooling in solidification of a hypereutectic Al-Si alloy; effect of solidifying within a ceramic preform composite
Solidification of undercooled Fe-Cr-Ni alloys. Part 2: Microstructural evolution