Joining of SiC Fiber-Bonded Ceramics using Silver, Copper, Nickel, Palladium, and Silicon-Based Alloy Interlayers

Journal Article · Tue Jan 01 04:00:00 EST 2013 · International Journal of Applied Ceramic Technology

DOI:https://doi.org/10.1111/ijac.12161· OSTI ID:1093133

Asthana, Rajiv ^[1]; Singh, Mrityunjay ^[2]; Lin, Hua-Tay ^[3]; Matsunaga, Kenji ^[4]; Ishikawa, Toshihiro ^[4]

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1. University of Wisconsin-Stout, Menomonie
2. NASA-Glenn Research Center, Cleveland
3. ORNL
4. Ube Industries, Ltd.

SiC fiber-bonded ceramics, SA-Tyrannohex, (SA-THX) with perpendicular and parallel fiber orientations were brazed using Ag-, Ni- and Pd-base brazes, and four Si X (X: Ti, Cr, Y, Ta) eutectics. Outcomes were variable, ranging from bonded joints through partially bonded to un-bonded joints. Prominent Ti- and Si-rich interfaces developed with Cusil-ABA, Ticusil, and Copper-ABA and Ni- and Si-rich layers with MBF-20. Stress rupture tests at 650 and 750 C on Cusil-ABA-bonded joints revealed a temperature-dependent behavior for the perpendicular joints but not for the parallel joints with failure occurring at brazed interface. Higher-use temperatures can be targeted with eutectic Si Ti and Si Cr alloys.

• Research Organization: Oak Ridge National Laboratory (ORNL)
• Sponsoring Organization: ORNL work for others
• DOE Contract Number: AC05-00OR22725
• OSTI ID: 1093133
• Journal Information: International Journal of Applied Ceramic Technology, Journal Name: International Journal of Applied Ceramic Technology Journal Issue: 5 Vol. 10; ISSN 1546-542X
• Country of Publication: United States
• Language: English

Related Subjects

SiC composite
brazing