use of TurboSiP Software to Predict the Long-Term Reliaility of Solder Joints on Photovoltaic Systems.

Conference · Sat Jun 01 00:00:00 EDT 2013

OSTI ID:1083089

Sorensen, Neil R; Yang, Benjamin Bing-Yeh; Vianco, Paul T; Holliday, Maynard; Neilsen, Michael K.; Kilgo, Alice C.; Rejent, Jerome Andrew; Grazier, John Mark; Johnson, Jay Dean; Granata, Jennifer E

Abstract not provided.

• Research Organization: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 1083089
• Report Number(s): SAND2013-4728C; 456211
• Country of Publication: United States
• Language: English