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The Effect of Ballistic Electron Transport on Copper-Niobium Thermal Interface Conductance.

Conference ·
OSTI ID:1079800
Abstract not provided.
Research Organization:
Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States); Sandia National Laboratories, Livermore, CA
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1079800
Report Number(s):
SAND2013-4089C; 453123
Country of Publication:
United States
Language:
English

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