Evidence of localized surface plasticity during stress corrosion cracking
- Univ. of Nevada, Reno, NV (United States)
Creep prior to stress corrosion cracking (SCC) has been frequently observed. Externally imposed anodic dissolution currents increase creep rates of pure metals and alloys in environments that do not cause SCC. Creep prior to SCC may result from anodic currents at active film rupture sites caused by coupling to surrounding noble passive surfaces. Several investigators have recently shown a correlation between creep rate and time to failure by SCC, implying that mechanisms of creep and cracking may be related. Recent thin-film diffusion experiments have shown evidence of vacancy formation at anodically dissolving copper surfaces. Anodically generated vacancies may increase creep by stimulating dislocation climb, as does elevated temperature during thermal creep or by attraction to dislocation cores. This paper reviews this and other information leading to a proposed SCC mechanism describing anodic attenuation of strain hardening, localized surface plasticity (LSP), crack initiation, and crack-tip embrittlement by anodic dissolution at film rupture sites.
- OSTI ID:
- 106143
- Report Number(s):
- CONF-950304--
- Country of Publication:
- United States
- Language:
- English
Similar Records
An evaluation of current models for the propagation of stress-corrosion cracks
Anodically enhanced diffusion in Cu/Ag thin film couples