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Title: Development of a Low Cost Insulated Foil Substrate for Cu(InGaSe)2 Photovoltaics

Technical Report ·
DOI:https://doi.org/10.2172/1053423· OSTI ID:1053423

The project validated the use of stainless steel flexible substrate coated with silicone-based resin dielectric, developed by Dow Corning Corporation, for Cu(InGa)Se2 based photovoltaics. The projects driving force was the high performance of Cu(InGa)Se2 based photovoltaics coupled with potential cost reduction that could be achieved with dielectric coated SS web substrate.

Research Organization:
Univ. of Delaware, Newark, DE (United States)
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE); USDOE EE Office of Solar Energy Technology (EE-2A)
DOE Contract Number:
FG36-08GO18068
OSTI ID:
1053423
Report Number(s):
DOEGO18068
Country of Publication:
United States
Language:
English

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