Planar Bond All: A New Packaging Technology for Advanced Automotive Power Modules
Conference
·
OSTI ID:1050372
- ORNL
No abstract prepared.
- Research Organization:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Research Facility
- Sponsoring Organization:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE)
- DOE Contract Number:
- DE-AC05-00OR22725
- OSTI ID:
- 1050372
- Resource Relation:
- Conference: IEEE Energy Conservation Congress & Exposition 2012 (ECCE2012), Raleigh, NC, USA, 20120915, 20120920
- Country of Publication:
- United States
- Language:
- English
Similar Records
Planar Bond All: A New Packaging Technology for Advanced Automotive Power Modules
Planar-Bond-All: A Technology for Three-dimensional Integration of Multiple Packaging Functions into Advanced Power Modules
Advanced Packaging of SiC Power Module for Automotive Applications
Conference
·
Sun Jan 01 00:00:00 EST 2012
·
OSTI ID:1050372
+1 more
Planar-Bond-All: A Technology for Three-dimensional Integration of Multiple Packaging Functions into Advanced Power Modules
Conference
·
Thu Jan 01 00:00:00 EST 2015
·
OSTI ID:1050372
Advanced Packaging of SiC Power Module for Automotive Applications
Conference
·
Tue Jan 01 00:00:00 EST 2013
·
OSTI ID:1050372