Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Thermoelectric properties of polycrystalline In4Se3 and In4Te3

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.3389494· OSTI ID:1049924
 [1];  [2];  [2];  [3];  [4]
  1. Optimal Inc., Plymouth, Michigan 48170, USA
  2. GM R&D and Planning, Warren, Michigan
  3. General Motors Corporation-R&D
  4. Oak Ridge National Laboratory (ORNL)
High thermoelectric performance of a single crystal layered compound In{sub 4}Se{sub 3} was reported recently. We present here an electrical and thermal transport property study over a wide temperature range for polycrystalline samples of In{sub 4}Se{sub 3} and In{sub 4}Te{sub 3}. Our data demonstrate that these materials are lightly doped semiconductors, leading to large thermopower and resistivity. Very low thermal conductivity, below 1 W/m K, is observed. The power factors for In{sub 4}Se{sub 3} and In{sub 4}Te{sub 3} are much smaller when compared with state-of-the-art thermoelectric materials. This combined with the very low thermal conductivity results in the maximum ZT value of less than 0.6 at 700 K for In{sub 4}Se{sub 3}.
Research Organization:
Oak Ridge National Laboratory (ORNL)
Sponsoring Organization:
SC USDOE - Office of Science (SC)
DOE Contract Number:
AC05-00OR22725
OSTI ID:
1049924
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 16 Vol. 96; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English

Similar Records

Electrical properties and figures of merit for new chalcogenide-based thermoelectric materials
Conference · Tue Jul 01 00:00:00 EDT 1997 · OSTI ID:20014275

Thermoelectric properties of CoSb{sub 3} and related alloys
Journal Article · Sat Jul 15 00:00:00 EDT 1995 · Journal of Applied Physics · OSTI ID:69043

Thermoelectric transport properties of BaBiTe{sub 3}-based materials
Journal Article · Mon May 15 00:00:00 EDT 2017 · Journal of Solid State Chemistry · OSTI ID:22658269