Silicon-Based Thermoelectrics: Harvesting Low Quality Heat Using Economically Printed Flexible Nanostructured Stacked Thermoelectric Junctions
Program Document
·
OSTI ID:1046743
Broad Funding Opportunity Announcement Project: UIUC is experimenting with silicon-based materials to develop flexible thermoelectric devices—which convert heat into energy—that can be mass-produced at low cost. A thermoelectric device, which resembles a computer chip, creates electricity when a different temperature is applied to each of its sides. Existing commercial thermoelectric devices contain the element tellurium, which limits production levels because tellurium has become increasingly rare. UIUC is replacing this material with microscopic silicon wires that are considerably cheaper and could be equally effective. Improvements in thermoelectric device production could return enough wasted heat to add up to 23% to our current annual electricity production.
- Research Organization:
- University of Illinois
- Sponsoring Organization:
- USDOE Advanced Research Projects Agency - Energy (ARPA-E)
- OSTI ID:
- 1046743
- Country of Publication:
- United States
- Language:
- English
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