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Title: Encapsulant materials and associated devices

Patent ·
OSTI ID:1042626

Compositions suitable for use as encapsulants are described. The inventive compositions include a high molecular weight polymeric material, a curing agent, an inorganic compound, and a coupling agent. Optional elements include adhesion promoting agents, colorants, antioxidants, and UV absorbers. The compositions have desirable diffusivity properties, making them suitable for use in devices in which a substantial blocking of moisture ingress is desired, such as photovoltaic (PV) modules.

Research Organization:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC36-99G010337
Assignee:
BRP Manufacturing Company (Lima, OH); Alliance for Sustainable Energy, LLC (Golden, CO)
Patent Number(s):
8,183,329
Application Number:
13/041,491
OSTI ID:
1042626
Country of Publication:
United States
Language:
English

References (5)

Moisture transport, adhesion, and corrosion protection of PV module packaging materials journal October 2006
Reliability of PV modules and balance-of-system components conference January 2005
Modeling of rates of moisture ingress into photovoltaic modules journal October 2006
Acetic acid production and glass transition concerns with ethylene-vinyl acetate used in photovoltaic devices journal February 2007
Control of moisture ingress into photovoltaic modules conference January 2005

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