Analysis of deformation mechanisms in the high temperature creep of an alumina matrix composite reinforced with SiC whiskers
Technical Report
·
OSTI ID:104207
The creep behavior of unreinforced polycrystailine alumina is now well documented: diffusion creep occurs at small grain sizes with a stress exponent, n, of 1 but at large grain sizes there is a transition to a dislocation mechanism with n close to 3. Experiments on an alumina composite, reinforced with 9.3 volume per cent of silicon carbide whiskers, show that the stress exponent is - 3.8 although the grain size of the alumina matrix is only - 2 micrometers. These results serve to demonstrate that there is a significant difference between the creep properties of unreinforced alumina and alumina composites. This difference is examined with special reference to the rate-controlling deformation mechanism occurring in the composite material.
- Research Organization:
- California Univ., Los Angeles, CA (United States)
- OSTI ID:
- 104207
- Report Number(s):
- AD-A--291686/4/XAB; CNN: Contract DAAL03-91-G-0230
- Country of Publication:
- United States
- Language:
- English
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