Modeling thin film, buckle-driven delamination along a metal/polymer interface in a stressed overlayer test.

Conference · Mon Nov 01 04:00:00 EDT 2010

OSTI ID:1030294

Moody, Neville Reid ^[1]; Corona, Edmundo

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1. Sandia National Laboratories, Livermore, CA

Interfacial delamination is often the critical failure mode limiting the performance of polymer/metal interfaces. Consequently methods that measure the toughness of such interfaces are of considerable interest. One approach for measuring the toughness of a polymer/metal interface is to use the stressed-overlayer test. In this test a metal substrate is coated with a sub-micron thick polymer film to create the interface of interest. An overlayer, typically a few tenths of a micron of sputtered tungsten, is then deposited on top of the polymer in such a way as to generate a very high residual compressive stress within the sputtered layer ({approx} 1-2 GPa). This highly stressed overlayer induces delamination and blister formation. The measured buckle heights and widths are then used in conjunction with a fracture mechanics analysis to infer interfacial toughness. Here we use a finite element, cohesive-zone-based, fracture analysis to perform the required interfacial crack growth simulation. This analysis shows that calculated crack growth is sensitive to the polymer layer thickness even when the layer is only 10's of nanometers thick. The inward displacement of the overlayer at the buckle edge, which is enabled by the relatively low polymer compliance, is the primary cause of differences from a rigid substrate idealization.

• Research Organization: Sandia National Laboratories
• Sponsoring Organization: USDOE
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 1030294
• Report Number(s): SAND2010-7718C
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ADHESION
BLISTERS
COMPLIANCE
CRACK PROPAGATION
FRACTURE MECHANICS
FRACTURES
PERFORMANCE
POLYMERS
SIMULATION
SUBSTRATES
THICKNESS
THIN FILMS
TUNGSTEN