Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses.
- Kansas City Plant, Kansas City, MO
Decisions on material selections for electronics packaging can be quite complicated by the need to balance the criteria to withstand severe impacts yet survive deep thermal cycles intact. Many times, material choices are based on historical precedence perhaps ignorant of whether those initial choices were carefully investigated or whether the requirements on the new component match those of previous units. The goal of this program focuses on developing both increased intuition for generic packaging guidelines and computational methodologies for optimizing packaging in specific components. Initial efforts centered on characterization of classes of materials common to packaging strategies and computational analyses of stresses generated during thermal cycling to identify strengths and weaknesses of various material choices. Future studies will analyze the same example problems incorporating the effects of curing stresses as needed and analyzing dynamic loadings to compare trends with the quasi-static conclusions.
- Research Organization:
- Sandia National Laboratories
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1022184
- Report Number(s):
- SAND2011-4751
- Country of Publication:
- United States
- Language:
- English
Similar Records
Irradiation of multilayered materials to improve performance for packaging of thermoprocessed foods
Compliant interlayer for advanced ceramic/metal engine components
Microwave coupling on printed circuit boards
Technical Report
·
Wed Dec 31 23:00:00 EST 1975
·
OSTI ID:7223248
Compliant interlayer for advanced ceramic/metal engine components
Journal Article
·
Sat Dec 31 23:00:00 EST 1994
· Automotive Engineering; (United States)
·
OSTI ID:6460265
Microwave coupling on printed circuit boards
Conference
·
Sat Dec 31 23:00:00 EST 1988
·
OSTI ID:7120816