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A capillary flow test for printed wiring boards

Technical Report ·
DOI:https://doi.org/10.2172/10189170· OSTI ID:10189170
; ; ;

No abstract available.

Research Organization:
Sandia National Labs., Center for Solder Science and Technology, Albuquerque, NM (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
10189170
Report Number(s):
SAND94-0603; ON: TI95020068; BR: GB0103012; CRN: C/SNL--SC9101030B
Country of Publication:
United States
Language:
English

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Related Subjects

42 ENGINEERING
420500
426000
CAPILLARY FLOW
COMPONENTS
ELECTRON DEVICES AND CIRCUITS
EXPERIMENTAL DATA
MATERIALS TESTING
MATHEMATICAL MODELS
PRINTED CIRCUITS
SOLDERING
TEST FACILITIES
TESTING
WETTABILITY