Laser soldering of Sn plated brass integrator assembly housings
The high conductivity provided by solder closure joints of component housings is sometimes required to ensure electrical shielding of the components contained within. However, using a soldering iron to produce the solder joints can lead to charring of the insulating materials within the housing. To overcome this problem, the localized heating characteristics of laser soldering can be exploited. Feasibility of laser soldering Sn plated brass housings with a CW Nd:YAG laser has been investigated. It has been determined that laser soldering of these housings using a low solids solder flux is a viable technique and will minimize the amount of heat input to the enclosed electronic components. Metallographic analysis has shown good wetting of the solder on the housing components. Accelerated aging experiments indicate that no significant corrosion potential due to solder flux residues exists. Although a low solids flux was used to make the joints, initial results indicate that a fluxless technique can be developed to eliminate fluxes completely.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 10186215
- Report Number(s):
- SAND--93-1138; CONF-9310194--1; ON: DE94001149
- Country of Publication:
- United States
- Language:
- English
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Fluxless laser soldering for electronic packaging
Fluxless laser soldering for electronic packaging