Measurement of residual stresses on ceramic materials with high spatial resolution

Conference · Fri Dec 31 00:00:00 EST 1993

OSTI ID:10177987

Kozaczek, K J ^[1]; Ruud, C O; Fitting, J D ^[2]

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1. Oak Ridge National Lab., TN (United States)
2. Pennsylvania State Univ., University Park, PA (United States)

A fast x-ray diffraction technique has been developed for measuring the residual stresses with high spatial resolution in ceramic materials. This resolution is limited by the mean size of grains and the radiation type. The effective diffraction elastic constants were experimentally determined for alumina as (E/l+{nu})){sub (1016)} = 200 GPa. The accuracy of XRD measurement of residual stresses with the spatial resolution of 170 {mu}m and precision {plus_minus} 15 MPa was verified experimentally by strain gauge measurements. The stress field around a singular Kovar pin brazed to alumina was asymmetric with high tangential stresses in the vicinity of the pin decreasing with the distance from the pin.

• Research Organization: Oak Ridge National Lab., TN (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC05-84OR21400
• OSTI ID: 10177987
• Report Number(s): CONF-930685-1; ON: DE94017889
• Resource Relation: Conference: 6. international symposium on nondestructive characterization of materials,Oahu, HI (United States),7-11 Jun 1993; Other Information: PBD: [1993]
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
CERAMICS
RESIDUAL STRESSES
MEASURING METHODS
X-RAY DIFFRACTION
360203
MECHANICAL PROPERTIES