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Title: Ultra-high current density thin-film Si diode

Patent ·
OSTI ID:1014501

A combination of a thin-film .mu.c-Si and a-Si:H containing diode structure characterized by an ultra-high current density that exceeds 1000 A/cm.sup.2, comprising: a substrate; a bottom metal layer disposed on the substrate; an n-layer of .mu.c-Si deposited the bottom metal layer; an i-layer of .mu.c-Si deposited on the n-layer; a buffer layer of a-Si:H deposited on the i-layer, a p-layer of .mu.c-Si deposited on the buffer layer; and a top metal layer deposited on the p-layer.

Research Organization:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC36-99GO10337
Assignee:
National Renewable Energy Laboratory (NREL), Golden, CO (United States)
Patent Number(s):
7,361,406
Application Number:
10/488,902
OSTI ID:
1014501
Country of Publication:
United States
Language:
English

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