The variability residual stresses of thick superconductor films during orthorhombic to tetragonal transformation
Conference
·
OSTI ID:10135656
- Illinois Univ., Chicago, IL (United States). Dept. of Civil Engineering, Mechanics, and Metallurgy
- Argonne National Lab., IL (United States)
YBa{sub 2}Cu{sub 3}O{sub x} thick films have been deposited by spray pyrolysis of a sol-gel on 10 cm diameter polycrystalline MgO wafers. The film thickness was built up in layers of approximately 1 {mu}m thick. The in-plane residual stresses were measured by an optical interferometry (shadow moire) method as a function of film structure. In-plane residual stress maps over the area of the wafer have been obtained. The average stress of the 5 {mu}m orthorhombic phase was 0.84 GPa. As the film transforms from the orthorhombic to the tetragonal structure, the tensile stresses decreased by 0.5 GPa.
- Research Organization:
- Argonne National Lab., IL (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-31109-ENG-38
- OSTI ID:
- 10135656
- Report Number(s):
- ANL/CP--75687; CONF-9203110--2; ON: DE92010499
- Country of Publication:
- United States
- Language:
- English
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