Design and simulation of an FPGA-based printed wiring assembly

Conference · Fri Dec 31 04:00:00 EST 1993

OSTI ID:10133082

Eilers, D L

Past generations of electronic products have been constructed using relatively few (often just one) field programmable gate arrays (FGPA) or Application Specific Integrated Circuits (ASIC) surrounded by a collection of medium to large scale integration parts. Today, the new generations of electronic products are becoming increasingly complex. The specification, design, and simulation of this new generation of FPGA and ASIC based products places additional demands on computer-aided engineering (CAE) systems. FPGA and ASIC devices offer both high pin count and high internal logic density. Both of these features serve to increase the density and functionality of the products in which they are used; however, these features also detract from the ability to debug the final hardware with conventional techniques. Fine pitch parts with high pin counts present a great challenge to probing. The simulations done on individual designs address many of these concerns; however, when FPGA`s and/or ASIC`s make up a significant portion of the electronics assembly or when the interfaces between them are complicated, product level simulation becomes very important. This paper will describe the electronic product realization process that has evolved in Department 2335 at Sandia National Laboratories. Department 2335 is a hardware development group which works to support various system development departments. The customers for these electronics products are a group of system design and integration engineers who architect and implement the final system. The following phases of the design process are described in terms of an FPGA based product design; however, they are generally applicable to all types of electronic designs. This paper contains the bulk of the details of the design process which was utilized to develop the latest generation of electronic products.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 10133082
• Report Number(s): SAND--93-2559C; CONF-9404119--1; ON: DE94007861; BR: GB0103012
• Country of Publication: United States
• Language: English

Related Subjects

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION
320303
42 ENGINEERING
426000
COMPONENTS
ELECTRON DEVICES AND CIRCUITS
COMPUTER-AIDED DESIGN
COMPUTERIZED SIMULATION
EQUIPMENT AND PROCESSES
INTEGRATED CIRCUITS
ORGANIZATIONAL MODELS
PRINTED CIRCUITS
PROCESS CONTROL