Flux pinning structures in melt-processed YBa{sub 2}Cu{sub 3}O{sub 7-x}
Conference
·
OSTI ID:10117423
Microstructural examination of melt-processed YBa{sub 2}Cu{sub 3}O{sub 7-x} has revealed the presence of a high density of stacking faults in the 123 surrounding entrapped 211 particles. Estimates of their pinning effectiveness and density suggest that dislocation loops bounding these stacking faults may explain the increase in J{sub c} in melt-processed material with 211/123 interfacial area.
- Research Organization:
- Oak Ridge National Lab., TN (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC05-84OR21400
- OSTI ID:
- 10117423
- Report Number(s):
- CONF-9211144--5; ON: DE93005151
- Country of Publication:
- United States
- Language:
- English
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