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U.S. Department of Energy
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Low temperature properties of engineering thermoplastics

Conference ·
OSTI ID:10108410
There are currently a wide variety of engineering thermoplastics available for a multitude of applications. Because of present market requirements, there has been a limited demand for test results of the physical properties of these materials at low temperatures. Several potential applications exist, however, and as a result, several engineering thermoplastic samples were tested at -40 and -56.6 °C. Although not all these tests followed the procedures specified by the American Society of Testing and Materials precisely, the data represent comparative data that can be utilized for further design efforts. The evaluations included tensile testing, compressive properties, and Izod impact testing. Several materials with varied glass loadings were studied to determine the low temperature tendencies these molding compounds would exhibit. Some of the resins examined were: polyetheretherketone (PEEK), polytherimide (PEI), polyphenylene sulfide (PPS), polyethersulfone (PES), polyphthlamide (PPA), and a liquid crystal polymer (Vectra A130). In all cases, no detrimental effect was discerned over this temperature range; the study also indicated that improvements in the physical properties could be expected.
Research Organization:
EG and G Mound Applied Technologies, Miamisburg, OH (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC04-88DP43495
OSTI ID:
10108410
Report Number(s):
MLM--3720(OP); CONF-911023--1; ON: DE92004009
Country of Publication:
United States
Language:
English

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