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Title: The effect of particulate debris on the insulation integrity of SSC coils during molding and collaring

Conference ·
OSTI ID:10103678

In order to simulate the effect of accidentally introduced debris on SSC coil insulation integrity, models consisting of two pieces of insulated SSC cable have been loaded in an hydraulic press after introducing foreign particles between the layers. The tests were originally suggested by R. Palmer of the SSC Laboratory. A high voltage (2 Kv) was continually applied between the two cables and the load gradually increased until an electrical short occurred. The high voltage was used as an easy method of detecting insulation punctures and to continue the general type of testing begun at Brookhaven by J. Skaritka, now at the SSC Laboratory, and continued at Fermilab by F. Markley and presented at last year`s session of the Conference. A range of particles of different size, shape, and hardness were used, and both conducting and insulating particles were included. Fine wires were also used. When the data are normalized using the control (no particles added), data for each cable batch used, there is a slight correlation between pressure at breakdown and particle size for cables insulated with Kapton only. Adjustment must be made for soft particles that tend to deform and for particles with aspect ratios greater than one. Additional measurements have also been made where the opoxy-fiberglass layer was added to the Kapton insulation overwrap. These show a correlation between conductivity and breakdown pressure. 1 ref., 7 figs.

Research Organization:
Fermi National Accelerator Lab., Batavia, IL (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC02-76CH03000
OSTI ID:
10103678
Report Number(s):
FNAL-TM-1726; CONF-910340-51; ON: DE92003885
Resource Relation:
Conference: 3. annual international industrialization symposium on the super collider (IISSC),Atlanta, GA (United States),13-15 Mar 1991; Other Information: PBD: Mar 1991
Country of Publication:
United States
Language:
English