X-ray Microbeam Diffraction Measurements in Polycrystalline Aluminum and Copper Thin Films
- Lehigh
Thermally induced residual strains in polycrystalline Cu and Al films on single crystal Si and glass substrates, respectively, have been examined on a grain-by-grain basis by x-ray microbeam diffraction. The crystallographic orientation and the deviatoric strain tensor, {var_epsilon}{sub ij}*, are determined for each grain by white beam Laue diffraction. From grain orientation mapping and strain tensor measurements, information is obtained about the distributions of strains for similarly oriented grains, about strain variations within single grains, and about grain-to-grain correlations of strains. This type of information may be useful in developing and testing theories for intergrain effects in strain evolution in polycrystals.
- Research Organization:
- Advanced Photon Source (APS), Argonne National Laboratory (ANL), Argonne, IL (US)
- Sponsoring Organization:
- USDOE
- OSTI ID:
- 1008698
- Journal Information:
- MRS Bull., Journal Name: MRS Bull. Journal Issue: 03, 2004 Vol. 795; ISSN MRSBEA; ISSN 0883-7694
- Country of Publication:
- United States
- Language:
- ENGLISH
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