(Use of lead-tin and tin-silver solders for edge clip attachment on polyimide-quartz circuit)
The solder alloys 96.5Sn3.5Ag and 90Pb10Sn were used to attach edge clips to polyimide-quartz circuit boards. An assessment of the solder joints was based upon visual and microscopic examinations as well as shear strength measurements. The boards were evaluated in the as-soldered condition as well as following thermal shock and thermal cycle exposure. The use of these solders has resulted in a reduction of the amount of rework required after this investigation has provided preliminary data applicable towards the general use of high melting point solders on polyimide-quartz boards for elevated temperature applications. The purpose of this investigation was to examine the use of two high melting temperature solders on polyimide-quartz circuit boards. 2 refs., 5 figs., 4 tabs.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- DOE/DP
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 6900821
- Report Number(s):
- SAND-90-0466C; ON: DE90011506
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
PRINTED CIRCUITS
FABRICATION
SOLDERED JOINTS
INSPECTION
SOLDERING
PROCESS CONTROL
COPPER
LAYERS
MELTING
PERFORMANCE TESTING
RESIDUES
SHEAR
STRENGTH FUNCTIONS
TEMPERATURE EFFECTS
THERMAL SHOCK
CONTROL
ELECTRONIC CIRCUITS
ELEMENTS
FUNCTIONS
JOINING
JOINTS
METALS
PHASE TRANSFORMATIONS
TESTING
TRANSITION ELEMENTS
WELDING
426000* - Engineering- Components
Electron Devices & Circuits- (1990-)
360104 - Metals & Alloys- Physical Properties
360101 - Metals & Alloys- Preparation & Fabrication