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Title: Hole-trapping/hydrogen transport (HT) sup 2 model for interface-trap buildup in MOS devices

Conference ·
OSTI ID:6763446

The electric field dependence of radiation-induced interface-trap formation has been reported to be different for metal-gate capacitors and polysilicon-gate capacitors and transistors. For metal-gate capacitors, interface-trap formation steadily increases with increasing positive field. On the other hand, for polysilicon-gate capacitors and transistors, interface-trap buildup peaks near fields of 1 MV/cm to 2 MV/cm and decreases with an approximate E{sup {minus}1/2} dependence at higher fields. The previously reported field dependence for interface-trap generation for Al-gate capacitors is consistent at all fields with McLean's physical explanation of the two-stage process, which depends on hydrogen ion (H {sup +}) release in the bulk of the oxide as radiation-induced holes transport to either interface via polaron hopping. Above 1 MV/cm, the field dependence of interface-trap buildup for polysilicon-gate devices is inconsistent with this model. Instead, it is similar to the field dependence for hole-trapping in SiO{sub 2}, suggesting that hole trapping may play a key role in interface-trap generation in Si-gate devices. However, recent studies of the time-dependence of interface-trap buildup have known that hole trapping cannot be the rate-limiting step in interface-trap buildup in polysilicon gate devices. Consistent with McLean's physical explanation of the two-stage process, the rate-limiting step in interface-trap formation appears to be H{sup +} transport to the Si/SiO{sub 2} interface. We will show that the electric field dependence of radiation-induced oxide- and interface-trap charge buildup for both polysilicon and metal-gate transistors follows an approximate E{sup {minus}1/2} field dependence over a wide range of electric fields when electron-hole recombination effects are included. Based on these results a hole trapping/hydrogen transport (HT){sup 2} model for interface-trap buildup is proposed.

Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
Sponsoring Organization:
DOE/DP
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6763446
Report Number(s):
SAND-90-2291C; CONF-901235-2; ON: DE91000020
Resource Relation:
Conference: 21. IEEE semiconductor interface specialists conference, San Diego, CA (USA), 6-8 Dec 1990
Country of Publication:
United States
Language:
English