Feasibilty of electroplated gold for hybrid microcircuits
Electroplating was investigated as a method of providing thick gold films. Because electroplated gold has never been used for hybrid microcircuit (HMC) substrate metallization, this feasibility study was also designed to determine the characteristics of electroplated gold and its compatibility with present HMC fabrication processes. Ceramic substrates 95 by 114 mm (3.75 by 4.5 in.) were electroplated with 6, 10, and 25 ..mu..m of gold after 0.02 ..mu..m of chromium and 0.5 ..mu..m of gold had been either sputtered or vacuum evaporated onto the substrate surfaces. Substrates vacuum evaporated with 6 ..mu..m of gold were used as a control group. The substrates were evaluated for via resistance, RF electrical characteristics, conductor definition and resolution, solder wettability, thermocompression bondability, and environmental stability.
- Research Organization:
- Bendix Corp., Kansas City, MO (United States)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 6167840
- Report Number(s):
- BDX-613-2114
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
CERAMICS
SUBSTRATES
GOLD
ELECTROPLATING
SURFACE COATING
BONDING
CHROMIUM
CRYSTAL STRUCTURE
ELECTRIC CONDUCTIVITY
ELECTRICAL PROPERTIES
FEASIBILITY STUDIES
FILMS
PHYSICAL PROPERTIES
SOLDERING
STABILITY
THICKNESS
WETTABILITY
DEPOSITION
DIMENSIONS
ELECTRODEPOSITION
ELECTROLYSIS
ELEMENTS
FABRICATION
JOINING
LYSIS
METALS
PLATING
TRANSITION ELEMENTS
WELDING
360101* - Metals & Alloys- Preparation & Fabrication
360104 - Metals & Alloys- Physical Properties