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Title: Thermal imaging measurement and correlation of thermal diffusivity in continuous fiber ceramic composites

Technical Report ·
DOI:https://doi.org/10.2172/554854· OSTI ID:554854
; ;  [1]; ;  [2];  [3]
  1. Argonne National Lab., IL (United States). Energy Technology Div.
  2. Dow Corning Corp., Midland, MI (United States)
  3. DuPont Lanxide Composites Inc., Newark, DE (United States)

Continuous fiber ceramic matrix composites (CFCCs) are currently being developed for a variety of high-temperature applications, including use in advanced heat engines. For such composites, knowledge of porosity distribution and presence of defects is important for optimizing mechanical and thermal behavior of the components. The assessment of porosity and its distribution is also necessary during composite processing to ensure component uniformity. To determine the thermal properties of CFCC materials, and particularly for detecting defects and nonuniformities, the authors have developed an infrared thermal imaging method to provide a single-shot full-field measurement of thermal diffusivity distributions in large components. This method requires that the back surface of a specimen receives a thermal pulse of short duration and that the temperature of the front surface is monitored as a function of time. The system has been used to measure thermal diffusivities of several CFCC materials with known porosity or density values, including SYLRAMIC{trademark} SiC/SiNC composite samples from Dow Corning and SiC/SiC and enhanced SiC/SiC samples from DuPont Lanxide Composites, to determine the relationship of thermal diffusivity to component porosity or density.

Research Organization:
Argonne National Lab. (ANL), Argonne, IL (United States)
Sponsoring Organization:
USDOE Assistant Secretary for Energy Efficiency and Renewable Energy, Washington, DC (United States)
DOE Contract Number:
W-31109-ENG-38; FC02-92CE40993; FC02-92CE40999
OSTI ID:
554854
Report Number(s):
ANL/ET/CP-93341; CONF-9710119-; ON: DE98050017; TRN: AHC29801%%117
Resource Relation:
Conference: 24. international thermal conductivity conference, Pittsburgh, PA (United States), 26-29 Oct 1997; Other Information: PBD: Sep 1997
Country of Publication:
United States
Language:
English