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Title: Power ratings of rf thin film resistive attenuators

Technical Report ·
DOI:https://doi.org/10.2172/5268769· OSTI ID:5268769

Most radio frequency (rf) assemblies built using hybrid microcircuit technology employ thin film attenuators. These attenuators are subject to moderate rf peak power and to moderate average power. Because of intracircuit mismatch, extra considerations of power requirements must be given. To meet these requirements, selected thin film resistive attenuators operated under large rf power conditions were investigated, and the power margin in which these attenuators can be used was defined.

Research Organization:
Bendix Corp., Kansas City, MO (United States)
DOE Contract Number:
AC04-76DP00613
OSTI ID:
5268769
Report Number(s):
BDX-613-2404
Country of Publication:
United States
Language:
English