Organic solderability preservation evaluation. Topical report
An evaluation was conducted to determine the possible replacement of the hot air solder leveling (HASL) process used in the Allied Signal Federal Manufacturing & Technologies (FM&T) Printed Wiring Board Facility with an organic solderability preservative (OSP). The drivers for replacing HASL include (1) Eliminating lead from PWB fabrication processes; (2) Potential legislation restricting use of lead, (3) Less expensive processing utilizing OSP rather than HASL processing; (4) Avoiding solder dross disposal inherent with HASL processing, (5) OSP provides flat, planar surface required for surface mount technology product, and (6) Trend to thinner PWB designs. A reduction in the cost of nonconformance (CONC) due to HASL defects (exposed copper, solderability, dewetting and non-wetting) would be realized with the incorporation of the OSP process. Several supplier HASL replacement candidates were initially evaluated. One supplier chemistry was chosen for potential use in the FM&T PWB and assembly areas.
- Research Organization:
- Allied-Signal, Inc., Kansas City, MO (United States). Bendix Kansas City Div.
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 491375
- Report Number(s):
- KCP-613-5885; ON: DE97052917; TRN: 97:004169
- Resource Relation:
- Other Information: PBD: Mar 1997
- Country of Publication:
- United States
- Language:
- English
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