High yield Cu-Co CPP GMR multilayer sensors
We have fabricated and tested GMR magnetic flux sensors that operate in the CPP mode. This work is a continuation of the ultra-high density magnetic sensor research introduced at INTERMAG 96. We have made two significant modifications to the process sequence. First, contact to the sensor is made through a metal conduit deposited in situ with the multilayers. This deposition replaces electroplating. This configuration ensures a good electrical interface between the top of multilayer stack and the top contact, and a continuous, conductive current path to the sensor. The consequences of this modification are an increase in yield of operational devices to {ge}90% per wafer and a significant reduction of the device resistance to {le}560 milliohms and of the uniformity of the device resistance to {le}3%. Second, the as-deposited multilayer structure has been changed from [Cu 30 {angstrom}/Co 20 {angstrom}]{sub 18} (third peak) to [Cu 20.5 {angstrom}/Co 12 {angstrom}]{sub 30} (second peak) to increase the CPP and CIP responses. The sheet film second peak CIP GMR response is 18% and the sensitivity is 0.08 %/Oe. The sheet film third peak CIP GMR response is 8% and the sensitivity is 0. 05 %/Oe. The second peak CPP GMR response averaged over twenty devices on a four inch silicon substrate is 28% {+-} 6%. The response decreases radially from the substrate center. The average response at the center of the substrate is 33% {+-} 4%. The average second peak CPP sensitivity is 0.09 %/Oe {+-} 0.02 %/Oe. The best second peak CPP response from a single device is 39%. The sensitivity of that device is 0.13 %/Oe. The third peak CPP GMR response is approximately 14 %. The third peak CPP response sensitivity is 0.07 %/Oe. 6 refs., 3 figs.
- Research Organization:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 486565
- Report Number(s):
- UCRL-JC-126325; CONF-970468-2; ON: DE97052044; TRN: 97:010974
- Resource Relation:
- Other Information: PBD: 15 Jan 1997
- Country of Publication:
- United States
- Language:
- English
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