Measurements of Thermal Conductivity of SUMMiT V(TM) Polysilicon Layers using a Steady-State Joule-Heating Method.
Conference
·
OSTI ID:1725936
Abstract not provided.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1725936
- Report Number(s):
- SAND2006-5060P; 525414
- Resource Relation:
- Conference: Proposed for presentation at the Student Intern Symposium held August 1, 2006 in Albuquerque, NM.
- Country of Publication:
- United States
- Language:
- English
Similar Records
Modified data analysis for thermal conductivity measurements of polycrystalline silicon microbridges using a steady state Joule heating technique.
Bond Pad Effects on Steady State Thermal Conductivity Measurement Using Suspended Micromachined Test Structures.
Thermal Conductivity Measurements on Polysilicon Microbridges Using the 3-Omega Technique.
Journal Article
·
Wed Aug 01 00:00:00 EDT 2012
· Proposed for publication in Review of Scientific Instruments.
·
OSTI ID:1725936
Bond Pad Effects on Steady State Thermal Conductivity Measurement Using Suspended Micromachined Test Structures.
Conference
·
Sat Sep 01 00:00:00 EDT 2007
·
OSTI ID:1725936
Thermal Conductivity Measurements on Polysilicon Microbridges Using the 3-Omega Technique.
Conference
·
Tue Jan 01 00:00:00 EST 2008
·
OSTI ID:1725936