Ionization-induced thermally activated defect-annealing process in SiC

Debelle, Aurélien; Thomé, Lionel; Monnet, Isabelle; Garrido, Frédérico; Pakarinen, Olli H.; Weber, William J.

doi:10.1103/PhysRevMaterials.3.063609

Title: Ionization-induced thermally activated defect-annealing process in SiC

Journal Article · Thu Jun 20 00:00:00 EDT 2019 · Physical Review Materials

DOI:https://doi.org/10.1103/PhysRevMaterials.3.063609· OSTI ID:1530075

Debelle, Aurélien ^[1]; Thomé, Lionel ^[1]; Monnet, Isabelle ^[2]; Garrido, Frédérico ^[1]; Pakarinen, Olli H. ^[3];

^[4]

Univ. Paris-Sud, Orsay (France)
Centre National de la Recherche Scientifique (CNRS), Caen (France)
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Univ. of Tennessee, Knoxville, TN (United States)

Ionizing events can lead to panoply of irradiation effects, and in silicon carbide (SiC), they drastically modify the defect production rate or the initial density. To better comprehend this phenomenon, 6H-SiC single crystals were first predamaged using low-velocity 100-keV Fe⁺ ions at three fluences in the range of 10¹⁴cm^-2 to induce three different initial disorder levels peaking at values between ~0.8 and 1 (1 corresponding to full amorphization). Crystals were then submitted to swift heavy ion irradiation in the 10¹³cm^-2 fluence range at both low (~100 K) and high (~770 K) temperature. Rutherford backscattering spectrometry in channeling conditions revealed that swift ions allow annealing part of the initial damage, the recovery efficiency increasing with the irradiation temperature and reaching 75% in initially severely disordered crystals. This temperature effect has been qualitatively predicted by molecular dynamics simulations. Transmission electron microscopy allowed imaging both the recovery and the difference in the microstructure of the layers irradiated at low or high temperature. Recovery cross sections are discovered to lie in the range of a few square nanometers, consistent with previously reported values. A scenario for a general, two-step annealing mechanism referred to as an ionization-activated, thermally assisted defect-annealing (IATADA) process is proposed. This mechanism rationalizes the diverse descriptions reported so far in the literature.

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Research Organization:: Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)

Sponsoring Organization:: USDOE Office of Science (SC), Basic Energy Sciences (BES) (SC-22). Materials Sciences & Engineering Division; USDOE Office of Science (SC), Basic Energy Sciences (BES)

Grant/Contract Number:: AC05-00OR22725

OSTI ID:: 1530075

Alternate ID(s):: OSTI ID: 1546362

Journal Information:: Physical Review Materials, Vol. 3, Issue 6; ISSN 2475-9953

Publisher:: American Physical Society (APS)Copyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 15 works

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