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Title: Apparatus and method for deterministic control of surface figure during full aperture pad polishing

Patent ·
OSTI ID:1398989
; ;

A polishing system configured to polish a lap includes a lap configured to contact a workpiece for polishing the workpiece; and a septum configured to contact the lap. The septum has an aperture formed therein. The radius of the aperture and radius the workpiece are substantially the same. The aperture and the workpiece have centers disposed at substantially the same radial distance from a center of the lap. The aperture is disposed along a first radial direction from the center of the lap, and the workpiece is disposed along a second radial direction from the center of the lap. The first and second radial directions may be opposite directions.

Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC52-07N27344
Assignee:
Lawrence Livermore National Security, LLC
Patent Number(s):
9,782,871
Application Number:
14/055,780
OSTI ID:
1398989
Resource Relation:
Patent File Date: 2013 Oct 16
Country of Publication:
United States
Language:
English

References (30)

Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish patent July 1996
Dressing apparatus and method patent July 1997
Polishing device and correcting method therefor patent October 1997
Polishing apparatus for finishing semiconductor wafer at high polishing rate under economical running cost patent May 1998
Apparatus for and method for polishing workpiece patent June 1998
Dual purpose retaining ring and polishing pad conditioner patent December 1999
Dual element lapping guide system patent February 2000
Automatic lapping method of a thin film element and a lapping apparatus using the same patent October 2000
Chemical mechanical polishing apparatus with improved substrate carrier head and method of use patent October 2000
Dressing apparatus for chemical mechanical polishing pad patent March 2001
Retaining ring for chemical mechanical polishing patent May 2001
Method for controlling machining process of workpiece patent December 2001
Optical monitoring in a two-step chemical mechanical polishing process patent January 2003
Optical monitoring in a two-step chemical mechanical polishing process patent October 2003
Polishing head and apparatus with an improved pad conditioner for chemical mechanical polishing patent March 2004
Method and apparatus for conditioning fixed-abrasive polishing pads patent June 2004
CMP in-situ conditioning with pad and retaining ring clean patent October 2004
Retaining ring for use in chemical mechanical polishing patent November 2004
Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface patent May 2005
Polishing pad refurbisher for in situ, real-time conditioning and cleaning of a polishing pad used in chemical-mechanical polishing of microelectronic substrates patent July 2006
Polishing apparatus patent-application November 2001
Wafer carrier used for chemical mechanic polishing patent-application April 2003
Retaining ring having reduced wear and contamination rate for a polishing head of a CMP tool patent-application July 2004
Polishing apparatus and polishing method patent-application September 2004
Method and device for simulation, method and device for polishing, method and device for preparing control parameters or control program, polishing system, recording medium, and method of manufacturing semiconductor device patent-application December 2004
Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus patent-application January 2006
Retaining Ring Structure for Enhanced Removal Rate During Fixed Abrasive Chemical Mechanical Polishing patent-application March 2007
Extended Life Conditioning Disk patent-application December 2007
Pad Conditioner for Chemical Mechanical Polishing patent-application April 2009
Retainer ring used for polishing a structure for manufacturing magnetic head, and polishing method using the same patent-application October 2009

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