Compact vehicle drive module having improved thermal control
An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
- Research Organization:
- Rockwell Automation Technologies, Inc., Mayfield Heights, OH (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FC02-99EE50571
- Assignee:
- Rockwell Automation Technologies, Inc. (Mayfield Heights, OH)
- Patent Number(s):
- 6,982,873
- Application Number:
- 10/252,466
- OSTI ID:
- 1175608
- Country of Publication:
- United States
- Language:
- English
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