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Title: Unified Creep Plasticity Damage (UCPD) Model for Solder.

Conference ·
OSTI ID:1107210

Abstract not provided.

Research Organization:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Sponsoring Organization:
USDOE National Nuclear Security Administration (NNSA)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
1107210
Report Number(s):
SAND2011-4459C; 465802
Resource Relation:
Conference: Proposed for presentation at the ASME IMECE 2011 held November 11-17, 2011 in Denver, CO.
Country of Publication:
United States
Language:
English

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