Encapsulation methods and dielectric layers for organic electrical devices
Patent
·
OSTI ID:1086738
The disclosure provides methods and materials suitable for use as encapsulation barriers and dielectric layers in electronic devices. In one embodiment, for example, there is provided an electroluminescent device or other electronic device with a dielectric layer comprising alternating layers of a silicon-containing bonding material and a ceramic material. The methods provide, for example, electronic devices with increased stability and shelf-life. The invention is useful, for example, in the field of microelectronic devices.
- Research Organization:
- SRI International (Menlo Park, CA)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- FC26-06NT42936
- Assignee:
- SRI International (Menlo Park, CA)
- Patent Number(s):
- 8,476,119
- Application Number:
- 13/202,065
- OSTI ID:
- 1086738
- Country of Publication:
- United States
- Language:
- English
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