Micromachined stylus ion traps through high aspect ratio lithography and electrochemical deposition.
Conference
·
OSTI ID:1078608
Abstract not provided.
- Research Organization:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NNSA)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 1078608
- Report Number(s):
- SAND2013-3050C; 447813
- Resource Relation:
- Conference: Proposed for presentation at the High Aspect Ratio Micro and Nano System Technologies held April 21-24, 2013 in Berlin, Germany .
- Country of Publication:
- United States
- Language:
- English
Similar Records
Micromachined stylus ion traps through high aspect ratio lithography and electrochemical deposition.
Micromachined stylus ion traps through high aspect ratio lithography and electrochemical deposition.
Optimizing Copper Deposition in High Aspect Ratio Through Silicon Vias.
Conference
·
Fri Mar 01 00:00:00 EST 2013
·
OSTI ID:1078608
Micromachined stylus ion traps through high aspect ratio lithography and electrochemical deposition.
Conference
·
Mon Apr 01 00:00:00 EDT 2013
·
OSTI ID:1078608
Optimizing Copper Deposition in High Aspect Ratio Through Silicon Vias.
Conference
·
Tue Nov 01 00:00:00 EDT 2022
·
OSTI ID:1078608
+2 more