Temperature-humidity-bias aging technique to identify defective surface mount capacitors
Ceramic chip capacitors can potentially crack due to thermal stresses in a surface mount assembly process. The electrical performance of the cracked capacitors will degrade with time, and they will prematurely short. In high reliability applications, the cracked capacitors must be identified and eliminated. We have developed and demonstrated the temperature-humidity-bias (THB) aging technique to identify cracked capacitors. The initial phase of the study involved setting up automated test equipment to monitor 100 surface mounted capacitors at 85% relative humidity, 85{degree}C with 50 volts dc bias. The capacitors subjected to severe thermal shock were aged along with control samples. Failure mode analysis was done on the failed capacitors. The capacitors with surface cracks short-out within the first 8 hours of aging, whereas the capacitors that failed after a longer aging time (8 to 1000 hours) had a shorting path in an internal void. Internal voids are typical defects introduced during manufacturing of multilayer ceramic (MLC) capacitors. In the second phase of the study, we used the THB aging technique to study the effect of surface mount processes on capacitor cracking and, thus the reliability. The surface mount processes studied were vapor phase, infra-red (IR) and convection belt reflow soldering. The results shoed that 6.3% of vapor phase soldered capacitors, and 1.25% of the IR and convection belt soldered capacitors had cracks. In all capacitors, regardless of the solder process used, an additional 3 to 4% of the capacitors failed due to a shorting path in the internal void. The results of this study confirm that this technique can be used to screen cracked capacitors and compare different solder and manufacturing processes.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 10129891
- Report Number(s):
- SAND-94-0054C; CONF-940337-2; ON: DE94005354; BR: GB0103012
- Resource Relation:
- Conference: 14. capacitor and resistor technology symposium,Jupiter Beach, FL (United States),21-24 Mar 1994; Other Information: PBD: [1994]
- Country of Publication:
- United States
- Language:
- English
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