Cooling of electronics in collider experiments
Proper cooling of detector electronics is critical to the successful operation of high-energy physics experiments. Collider experiments offer unique challenges based on their physical layouts and hermetic design. Cooling systems can be categorized by the type of detector with which they are associated, their primary mode of heat transfer, the choice of active cooling fluid, their heat removal capacity and the minimum temperature required. One of the more critical detector subsystems to require cooling is the silicon vertex detector, either pixel or strip sensors. A general design philosophy is presented along with a review of the important steps to include in the design process. Factors affecting the detector and cooling system design are categorized. A brief review of some existing and proposed cooling systems for silicon detectors is presented to help set the scale for the range of system designs. Fermilab operates two collider experiments, CDF & D0, both of which have silicon systems embedded in their detectors. A review of the existing silicon cooling system designs and operating experience is presented along with a list of lessons learned.
- Research Organization:
- Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
- Sponsoring Organization:
- USDOE Office of Energy Research (ER) (US)
- DOE Contract Number:
- AC02-76CH03000
- OSTI ID:
- 817288
- Report Number(s):
- FERMILAB-Conf-03/352-E; TRN: US0305165
- Resource Relation:
- Conference: LECC 2003, Amsterdam (NL), 09/29/2003--10/03/2003; Other Information: PBD: 7 Nov 2003
- Country of Publication:
- United States
- Language:
- English
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