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Title: Silicon nitride formation from a silane-nitrogen ECR (electron cyclotron resonance) plasma

Conference ·
OSTI ID:6543589
;  [1]; ;  [2];  [3]
  1. Sandia National Labs., Albuquerque, NM (USA)
  2. Microscience, Inc., Norwell, MA (USA)
  3. Michigan Univ., Ann Arbor, MI (USA). Dept. of Nuclear Engineering

Good quality, low temperature silicon nitride and oxynitride films were deposited downstream from an electron cyclotron resonance (ECR) plasma source using SiH{sub 4} and N{sub 2} gas mixtures. The Si/N ratio and H content in the deposited films were determined using Rutherford backscattering spectrometry (RBS)and elastic recoil detection (ERD). The H concentration was minimum for films with compositions closest to that of stoichiometric Si{sub 3}N{sub 4}. The optimum conditions for producing a stoichiometric Si{sub 3}N{sub 4}were: a SiH{sub 4}/N{sub 2} flow ratio between 0.1 and 0.2, and an electrically isolated sample far from the ECR source. Infrared absorption spectra showed that as the film composition changed from N rich to Si rich the dominant bonds associated with H changed from N-H to Si-H. The addition of O{sub 2} to the background gas formed an oxynitride with a low H content similar to the stoichiometric Si{sub 3}N{sub 4} 10 refs., 4 figs., 2 tabs.

Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
Sponsoring Organization:
DOE/DP
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6543589
Report Number(s):
SAND-90-2551C; CONF-901035-5; ON: DE91001265
Resource Relation:
Conference: 37. national American Vacuum Society symposium, Toronto (Canada), 8-12 Oct 1990
Country of Publication:
United States
Language:
English