Shallow junction formation by polyatomic cluster ion implantation
- Kyoto Univ., Sakyo (Japan)
Recent integrated circuits require shallow junctions which are less than 0.1 {mu}m depth. This creates a strong demand for low energy ion beam techniques. Equivalent low-energy and high-current ion beams can be realized quite easily with clusters, because the kinetic energy of the cluster is shared between the constituent atoms. Additionally, cluster-ion beams avoid damage due to excessive charge. We have used polyatomic clusters, decaborane (B{sub 10}H{sub 14}), as a kind of B cluster, in order to form a very shallow p{sup +} junction. A B SIMS profile of B{sub 10}H{sub 14} implanted into Si (100) at 20keV was quite similar to that of B implanted at 2keV. These SIMS measurements revealed that the cluster ion beam can realize equivalent low-energy implantation quite easily. The implantation efficiency achieved was about 90%. The damage induced by B{sub 10}H{sub 14} implantation was completely removed by a 600{degrees}C furnace anneal for 30 min, and implanted B atoms were electrically activated. After rapid thermal annealing (RTA) at 900{degrees}C of a sample prepared with a close of 5{times}10{sup 13} ion/cm{sup 2}, the sheet resistance decreased to about 600W/sq. and the activation efficiency was about 50%. These results show that a polyatomic cluster ion beam is useful for shallow junction formation.
- OSTI ID:
- 621331
- Report Number(s):
- CONF-9606110-; TRN: 98:002114-0074
- Resource Relation:
- Conference: 11. international conference on ion implantation technology, Austin, TX (United States), 17-21 Jun 1996; Other Information: PBD: 1996; Related Information: Is Part Of Ion implantation technology - 96; Ishida, E.; Banerjee, S.; Mehta, S. [eds.] [and others]; PB: 859 p.
- Country of Publication:
- United States
- Language:
- English
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