On-clip high frequency reliability and failure test structures
Patent
·
OSTI ID:504963
Self-stressing test structures for realistic high frequency reliability characterizations. An on-chip high frequency oscillator, controlled by DC signals from off-chip, provides a range of high frequency pulses to test structures. The test structures provide information with regard to a variety of reliability failure mechanisms, including hot-carriers, electromigration, and oxide breakdown. The system is normally integrated at the wafer level to predict the failure mechanisms of the production integrated circuits on the same wafer. 22 figs.
- Research Organization:
- AT&T
- DOE Contract Number:
- AC04-76DP00789
- Assignee:
- Sandia Corp., Albuquerque, NM (United States)
- Patent Number(s):
- US 5,625,288/A/
- Application Number:
- PAN: 8-590,690
- OSTI ID:
- 504963
- Resource Relation:
- Other Information: PBD: 29 Apr 1997
- Country of Publication:
- United States
- Language:
- English
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