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Title: Scalable sub-micron patterning of organic materials toward high density soft electronics

Journal Article · · Scientific Reports
DOI:https://doi.org/10.1038/srep14520· OSTI ID:1258788
 [1];  [2];  [2];  [2];  [2];  [2];  [3];  [2];  [4];  [5];  [6];  [7];  [8];  [3];  [2]
  1. Chung-Ang Univ., Seoul (Korea); Hanbat National Univ., Daejeon (Korea)
  2. Chung-Ang Univ., Seoul (Korea)
  3. Sungkyunkwan Univ., Suwon (Korea)
  4. Stony Brook Univ., Stony Brook, NY (United States)
  5. Brookhaven National Lab. (BNL), Upton, NY (United States)
  6. Gyeonsang National Univ. and Research Institute of Nature Science (RINS), Jinju (Korea)
  7. Dongguk Univ., Seoul (Korea)
  8. Hangyang Univ., Seoul (Korea)
+ Show Author Affiliations

The success of silicon based high density integrated circuits ignited explosive expansion of microelectronics. Although the inorganic semiconductors have shown superior carrier mobilities for conventional high speed switching devices, the emergence of unconventional applications, such as flexible electronics, highly sensitive photosensors, large area sensor array, and tailored optoelectronics, brought intensive research on next generation electronic materials. The rationally designed multifunctional soft electronic materials, organic and carbon-based semiconductors, are demonstrated with low-cost solution process, exceptional mechanical stability, and on-demand optoelectronic properties. Unfortunately, the industrial implementation of the soft electronic materials has been hindered due to lack of scalable fine-patterning methods. In this report, we demonstrated facile general route for high throughput sub-micron patterning of soft materials, using spatially selective deep-ultraviolet irradiation. For organic and carbon-based materials, the highly energetic photons (e.g. deep-ultraviolet rays) enable direct photo-conversion from conducting/semiconducting to insulating state through molecular dissociation and disordering with spatial resolution down to a sub-μm-scale. As a result, the successful demonstration of organic semiconductor circuitry promise our result proliferate industrial adoption of soft materials for next generation electronics.

Research Organization:
Brookhaven National Laboratory (BNL), Upton, NY (United States)
Sponsoring Organization:
USDOE
OSTI ID:
1258788
Journal Information:
Scientific Reports, Vol. 5; ISSN 2045-2322
Publisher:
Nature Publishing GroupCopyright Statement
Country of Publication:
United States
Language:
English
Citation Metrics:
Cited by: 9 works
Citation information provided by
Web of Science

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Cited By (5)

Ultrahigh Detective Heterogeneous Photosensor Arrays with In-Pixel Signal Boosting Capability for Large-Area and Skin-Compatible Electronics journal March 2016
Thread-Like CMOS Logic Circuits Enabled by Reel-Processed Single-Walled Carbon Nanotube Transistors via Selective Doping journal June 2017
Direct Photopatterning of Solution-Processed Amorphous Indium Zinc Oxide and Zinc Tin Oxide Semiconductors-A Chimie Douce Molecular Precursor Approach to Thin Film Electronic Oxides journal June 2018
Facile organic surfactant removal of various dimensionality nanomaterials using low-temperature photochemical treatment journal January 2019
Recent progress in printable organic field effect transistors journal January 2019

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36 MATERIALS SCIENCE