Ordered and Patterned Assembly of Organic Micro/Nanocrystals for Flexible Electronic and Optoelectronic Devices

Deng, Wei; Zhang, Xiujuan; Zhang, Xiaohong; Guo, Jinghua; Jie, Jiansheng

doi:10.1002/admt.201600280

Title: Ordered and Patterned Assembly of Organic Micro/Nanocrystals for Flexible Electronic and Optoelectronic Devices

Journal Article · Thu Apr 20 00:00:00 EDT 2017 · Advanced Materials Technologies

DOI:https://doi.org/10.1002/admt.201600280· OSTI ID:1401786

Deng, Wei ^[1]; Zhang, Xiujuan ^[1]; Zhang, Xiaohong ^[1]; Guo, Jinghua ^[2]; Jie, Jiansheng ^[1]

Institute of Functional Nano &, Soft Materials (FUNSOM) Collaborative Innovation Center of Suzhou Nano Science and Technology (NANO‐CIC) Jiangsu Key Laboratory for Carbon‐Based Functional Materials &, Devices Soochow University Suzhou Jiangsu 215123 P. R. China
Advanced Light Source Lawrence Berkeley National Laboratory Berkeley CA 94720 USA

Organic semiconductor micro/nanocrystals (OSMCs) have attracted intensive research over the past few decades. Their unique electrical and mechanical properties afford them applications in a vast network of active flexible electronic and optoelectronic fields, such as organic field‐effect transistors (OFETs), photodetectors (PDs), and organic light‐emitting diodes (OLEDs) etc. However, the growth orientation and location of OSMCs are usually stochastic in nature, which hinders the further use of OSMCs in large‐area plastic electronic devices. On the other hand, traditional microelectronic processing techniques like photolithography may damage the plastic substrates, polymer insulators, and organic materials. Thus the alignment and patterning of OSMCs and development of new device construction technologies are prerequisite for their flexible device applications in practice. In this progress report,the important advancement for fabricating the aligned and patterned OSMCs, with a focus on their applications in next‐generation flexible electronic and optoelectronic devices, is highlighted. Also, the challenges and outlooks of the ordered and patterned OSMCs in the flexible device applications are presented.

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Sponsoring Organization:: USDOE

Grant/Contract Number:: DE‐AC02‐05CH11231

OSTI ID:: 1401786

Journal Information:: Advanced Materials Technologies, Journal Name: Advanced Materials Technologies Vol. 2 Journal Issue: 7; ISSN 2365-709X

Publisher:: Wiley Blackwell (John Wiley & Sons)Copyright Statement

Country of Publication:: United States

Language:: English

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Cited by: 19 works

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