Search Menu
DOE PAGES title logo U.S. Department of Energy
Office of Scientific and Technical Information
Search Scholarly Publications

Title: Formation and Growth of Stacking Fault Tetrahedra in Ni via Vacancy Aggregation Mechanism

Abstract

Using molecular dynamics simulations, the formation and growth of stacking fault tetrahedra (SFT) are captured by vacancy cluster diffusion and aggregation mechanisms in Ni. The vacancytetrahedron acts as a nucleation point for SFT formation. Simulations show that perfect SFT can grow to the next size perfect SFT via a vacancy aggregation mechanism. The stopping and range of ions in matter (SRIM) calculations and transmission electron microscopy (TEM) observations reveal that SFT can form farther away from the initial cascade-event locations, indicating the operation of diffusion-based vacancy-aggregation mechanism.

Authors:
 [1];  [2];  [3];  [3];  [3];  [2];  [4]
+ Show Author Affiliations
  1. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Univ. of Wyoming, Laramie, WY (United States)
  2. Univ. of Michigan, Ann Arbor, MI (United States)
  3. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
  4. Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States); Univ. of Tennessee, Knoxville, TN (United States)
Publication Date:
Research Org.:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States); Energy Frontier Research Centers (EFRC) (United States). Energy Dissipation to Defect Evolution (EDDE)
Sponsoring Org.:
USDOE Office of Science (SC), Basic Energy Sciences (BES)
OSTI Identifier:
1286924
Alternate Identifier(s):
OSTI ID: 1359852
Grant/Contract Number:  
AC05-00OR22725; AC02-05CH11231
Resource Type:
Accepted Manuscript
Journal Name:
Scripta Materialia
Additional Journal Information:
Journal Volume: 114; Related Information: EDDE partners with Oak Ridge National Laboratory (lead); Lawrence Livermore National Laboratory; University of Michigan; University of Tennessee; University of Wisconsin; University of Wyoming; Virginia Tech; Journal ID: ISSN 1359-6462
Publisher:
Elsevier
Country of Publication:
United States
Language:
English
Subject:
74 ATOMIC AND MOLECULAR PHYSICS; Molecular dynamics; stacking fault tetrahedra; diffusion; vacancies

Citation Formats

Aidhy, Dilpuneet S., Lu, Chenyang, Jin, Ke, Bei, Hongbin, Zhang, Yanwen, Wang, Lumin, and Weber, William J. Formation and Growth of Stacking Fault Tetrahedra in Ni via Vacancy Aggregation Mechanism. United States: N. p., 2015. Web. doi:10.1016/j.scriptamat.2015.12.020.
Copy to clipboard
Aidhy, Dilpuneet S., Lu, Chenyang, Jin, Ke, Bei, Hongbin, Zhang, Yanwen, Wang, Lumin, & Weber, William J. Formation and Growth of Stacking Fault Tetrahedra in Ni via Vacancy Aggregation Mechanism. United States. https://doi.org/10.1016/j.scriptamat.2015.12.020
Copy to clipboard
Aidhy, Dilpuneet S., Lu, Chenyang, Jin, Ke, Bei, Hongbin, Zhang, Yanwen, Wang, Lumin, and Weber, William J. Tue . "Formation and Growth of Stacking Fault Tetrahedra in Ni via Vacancy Aggregation Mechanism". United States. https://doi.org/10.1016/j.scriptamat.2015.12.020. https://www.osti.gov/servlets/purl/1286924.
Copy to clipboard
@article{osti_1286924,
title = {Formation and Growth of Stacking Fault Tetrahedra in Ni via Vacancy Aggregation Mechanism},
author = {Aidhy, Dilpuneet S. and Lu, Chenyang and Jin, Ke and Bei, Hongbin and Zhang, Yanwen and Wang, Lumin and Weber, William J.},
abstractNote = {Using molecular dynamics simulations, the formation and growth of stacking fault tetrahedra (SFT) are captured by vacancy cluster diffusion and aggregation mechanisms in Ni. The vacancytetrahedron acts as a nucleation point for SFT formation. Simulations show that perfect SFT can grow to the next size perfect SFT via a vacancy aggregation mechanism. The stopping and range of ions in matter (SRIM) calculations and transmission electron microscopy (TEM) observations reveal that SFT can form farther away from the initial cascade-event locations, indicating the operation of diffusion-based vacancy-aggregation mechanism.},
doi = {10.1016/j.scriptamat.2015.12.020},
journal = {Scripta Materialia},
number = ,
volume = 114,
place = {United States},
year = {Tue Dec 29 00:00:00 EST 2015},
month = {Tue Dec 29 00:00:00 EST 2015}
}
Copy to clipboard
Journal Article:
Free Publicly Available Full Text
Publisher's Version of Record
https://doi.org/10.1016/j.scriptamat.2015.12.020
Copyright Statement
Other availability
Search WorldCat Search WorldCat to find libraries that may hold this journal
Citation Metrics:
Cited by: 40 works
Citation information provided by
Web of Science
Save / Share:
Export Metadata
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.

Works referenced in this record:

Story of stacking fault tetrahedra
journal, September 1997

Annealing of Pure Gold Quenched from above 800°C
journal, January 1963

Defect accumulation in pure fcc metals in the transient regime: a review
journal, November 1993

Direct observations of defects in quenched gold
journal, January 1959

Atomistic simulation of stacking fault tetrahedra formation in Cu
journal, December 2000

Stacking fault tetrahedra in metals
journal, January 2015

Review: Evolution of stacking fault tetrahedra and its role in defect accumulation under cascade damage conditions
journal, July 2004

On the formation of stacking fault tetrahedra in irradiated austenitic stainless steels – A literature review
journal, November 2013

The Growth Mechanism of Stacking‐Fault Tetrahedra in Quenched gold
journal, July 1963

  • Kimura, H.; Kuhlmann‐Wilsdorf, D.; Maddin, R.
  • Applied Physics Letters, Vol. 3, Issue 1
  • DOI: 10.1063/1.1723560

Nucleation process of stacking fault tetrahedra in gold studied by positron lifetime spectroscopy
journal, June 1985

  • Shirai, Y.; Furukawa, K.; Takamura, J.
  • Applied Physics A Solids and Surfaces, Vol. 37, Issue 2
  • DOI: 10.1007/BF00618855

Stable and Metastable Tetravacancies in an fcc Metal
journal, February 1965

An experimental determination of the electrical resistivity of stacking faults and lattice vacancies in gold
journal, November 1961

Vacancy loops and stacking-fault tetrahedra in copper: II. Growth, shrinkage, interactions with point defects and thermal stability
journal, September 1999

Defect cluster formation in displacement cascades in copper
journal, June 2001

  • Osetsky, Yu. N.; Bacon, D. J.
  • Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, Vol. 180, Issue 1-4
  • DOI: 10.1016/S0168-583X(01)00400-1

Formation of stacking-fault tetrahedra in collision cascades
journal, May 1999

  • Nordlund, K.; Gao, F.
  • Applied Physics Letters, Vol. 74, Issue 18
  • DOI: 10.1063/1.123948

Interatomic potential for studying ageing under irradiation in stainless steels: the FeNiCr model alloy
journal, October 2013

  • Bonny, G.; Castin, N.; Terentyev, D.
  • Modelling and Simulation in Materials Science and Engineering, Vol. 21, Issue 8
  • DOI: 10.1088/0965-0393/21/8/085004

Interatomic potential to study plasticity in stainless steels: the FeNiCr model alloy
journal, November 2011

  • Bonny, G.; Terentyev, D.; Pasianot, R. C.
  • Modelling and Simulation in Materials Science and Engineering, Vol. 19, Issue 8
  • DOI: 10.1088/0965-0393/19/8/085008

Fast Parallel Algorithms for Short-Range Molecular Dynamics
journal, March 1995

Multiple defects in copper and silver
journal, April 1985

Mobility and coalescence of stacking fault tetrahedra in Cu
journal, March 2015

  • Martínez, Enrique; Uberuaga, Blas P.
  • Scientific Reports, Vol. 5, Issue 1
  • DOI: 10.1038/srep09084

Direct Transformation of Vacancy Voids to Stacking Fault Tetrahedra
journal, September 2007

The formation of stacking fault tetrahedra in Al and CuI. Dipole annihilation and the nucleation stage
journal, January 2011

    Sort by:
    [ × clear filter / sort ]

    Works referencing / citing this record:

    Classical interatomic potential for quaternary Ni–Fe–Cr–Pd solid solution alloys
    journal, August 2018

    • Bonny, G.; Chakraborty, D.; Pandey, S.
    • Modelling and Simulation in Materials Science and Engineering, Vol. 26, Issue 6
    • DOI: 10.1088/1361-651x/aad2e7

    Dynamic formation and destruction process of stacking fault tetrahedra in single-crystal Ni during nanoscale cryo-rolling
    journal, July 2019

      Sort by:
      [ × clear filter / sort ]

      Similar Records in DOE PAGES and OSTI.GOV collections: