Robust Ag nanoplate ink for flexible electronics packaging
Abstract
Nanoinks are currently a topic of heightened interest with respect to low temperature bonding processes and printable electronics. We have developed an innovative polyvinylpyrrolidone (PVP)-stabilized Ag nanoplate ink amenable to very strong low temperature packaging, and investigated the relationship between bonding strength and electrical conductivity post-bonding. PVP shell plastic deformations observed in failure microcracks with the formation of PVP nanofibers, revealed bonding strength at low temperatures (<250 °C) was primarily due to adhesive bonding. Here, it is found that, utilizing photonic sintering, ~70 °C reduction of transformation temperature from adhesive to metallic bonding was achieved compared to that of thermal sintering. A numerical simulation was developed to better understand the influences of the light-induced heat generation, which demonstrated near-infrared light can facilitate sintering. Bonding strengths of 27 MPa were achieved at room temperatures, and 29.4 MPa at 210 °C with photonic sintering. Moreover, the anisotropic resistivity was observed with different thermal dependences. Furthermore, these results demonstrate Ag nanoplate inks have potential for low temperature 3D interconnections in lead-free microcircuits, flexible electronic packaging, and diverse sensing applications.
- Authors:
-
- Southeast Univ., Key Lab. of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, Nanjing (China); Univ. of Tennessee, Knoxville, TN (United States); Suzhou Research Institute of Southeast Univ., Suzhou (China)
- Univ. of Tennessee, Knoxville, TN (United States)
- Cape Breton Univ. Sydney (Canada)
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States)
- Southeast Univ., Key Lab. of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, Nanjing (China); Suzhou Research Institute of Southeast Univ., Suzhou (China)
- Publication Date:
- Research Org.:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States). Center for Nanophase Materials Sciences (CNMS)
- Sponsoring Org.:
- USDOE Office of Science (SC); National Natural Science Foundation of China (NSFC); Ministry of Education of the People's Republic of China (MOE)
- OSTI Identifier:
- 1266026
- Grant/Contract Number:
- AC05-00OR22725; 61307066; 20110092110016; 20130092120024; BK20130630; 2011CB302004; 201204,
- Resource Type:
- Accepted Manuscript
- Journal Name:
- Nanoscale
- Additional Journal Information:
- Journal Volume: 7; Journal Issue: 16; Journal ID: ISSN 2040-3364
- Publisher:
- Royal Society of Chemistry
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 77 NANOSCIENCE AND NANOTECHNOLOGY
Citation Formats
Li, Ruo -Zhou, Hu, Anming, Bridges, Denzel, Oakes, Ken D., Peng, Rui, Tumuluri, Uma, Wu, Zili, Feng, Zhili, and Zhang, Tong. Robust Ag nanoplate ink for flexible electronics packaging. United States: N. p., 2015.
Web. doi:10.1039/c5nr00312a.
Li, Ruo -Zhou, Hu, Anming, Bridges, Denzel, Oakes, Ken D., Peng, Rui, Tumuluri, Uma, Wu, Zili, Feng, Zhili, & Zhang, Tong. Robust Ag nanoplate ink for flexible electronics packaging. United States. https://doi.org/10.1039/c5nr00312a
Li, Ruo -Zhou, Hu, Anming, Bridges, Denzel, Oakes, Ken D., Peng, Rui, Tumuluri, Uma, Wu, Zili, Feng, Zhili, and Zhang, Tong. Tue .
"Robust Ag nanoplate ink for flexible electronics packaging". United States. https://doi.org/10.1039/c5nr00312a. https://www.osti.gov/servlets/purl/1266026.
@article{osti_1266026,
title = {Robust Ag nanoplate ink for flexible electronics packaging},
author = {Li, Ruo -Zhou and Hu, Anming and Bridges, Denzel and Oakes, Ken D. and Peng, Rui and Tumuluri, Uma and Wu, Zili and Feng, Zhili and Zhang, Tong},
abstractNote = {Nanoinks are currently a topic of heightened interest with respect to low temperature bonding processes and printable electronics. We have developed an innovative polyvinylpyrrolidone (PVP)-stabilized Ag nanoplate ink amenable to very strong low temperature packaging, and investigated the relationship between bonding strength and electrical conductivity post-bonding. PVP shell plastic deformations observed in failure microcracks with the formation of PVP nanofibers, revealed bonding strength at low temperatures (<250 °C) was primarily due to adhesive bonding. Here, it is found that, utilizing photonic sintering, ~70 °C reduction of transformation temperature from adhesive to metallic bonding was achieved compared to that of thermal sintering. A numerical simulation was developed to better understand the influences of the light-induced heat generation, which demonstrated near-infrared light can facilitate sintering. Bonding strengths of 27 MPa were achieved at room temperatures, and 29.4 MPa at 210 °C with photonic sintering. Moreover, the anisotropic resistivity was observed with different thermal dependences. Furthermore, these results demonstrate Ag nanoplate inks have potential for low temperature 3D interconnections in lead-free microcircuits, flexible electronic packaging, and diverse sensing applications.},
doi = {10.1039/c5nr00312a},
journal = {Nanoscale},
number = 16,
volume = 7,
place = {United States},
year = {Tue Mar 24 00:00:00 EDT 2015},
month = {Tue Mar 24 00:00:00 EDT 2015}
}
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